moldingcompound

EMC(EpoxyMoldingCompound)半導體等級封裝環氧樹酯.Definition&Features.Composition:EpoxyResin,Hardner,Filler(Silica),SomeAdditives,Moldcompoundsaretheplasticsusedtoencapsulatemanytypesofelectronicpackages,fromcapacitorsandtransistorstocentralprocessingunits(CPUs)and ...,MoldingCompoundsarethermosettingplasticswithverygoodmechanical,electricalinsulationandtemperatureresistanceproperties.,Semic...

參考資訊如下
EMC

EMC (Epoxy Molding Compound) 半導體等級 封裝環氧樹酯. Definition & Features. Composition: Epoxy Resin, Hardner, Filler(Silica), Some Additives

Mold Compound

Mold compounds are the plastics used to encapsulate many types of electronic packages, from capacitors and transistors to central processing units (CPUs) and ...

Molding Compounds

Molding Compounds are thermosetting plastics with very good mechanical, electrical insulation and temperature resistance properties.

Semiconductor Epoxy Mold Compounds

Semiconductor molding compounds are fine filled, electrically stable compounds, ideal for the miniaturised semiconductor packaging requirements.

EPOXY MOLDING COMPOUNDS

電晶體封裝. 電晶體封裝成型材料，成型性佳及優良信賴性。 Photocoupler封裝.

高純度二氧化矽封裝填充材料技術與發展

2021年1月20日 — 在半導體封裝製程中，不論是傳統的導線架(Lead Frame)構裝，或是先進的覆晶(Flip Chip)與晶圓級(Wafer Level)封裝，均需使用模封材料(Molding Compound)。

半導體構裝用封裝材料之發展概況

2021年11月10日 — 固態模封材料(Epoxy Molding Compound; EMC)主要是由環氧樹脂、酚醛樹脂、觸媒、二氧化矽微粉等組成，是發展最早、應用最成熟的環氧塑封料種類，如圖一。

Molding Compound

In essence, the mold material consists of sand, usually silica in a quartz form, clay, charcoal and water. A typical composition for green sand is: 81 wt% ...